STMicroelectronics enhances sustainability with chiller cooling system at Toa Payoh

SP and STMicroelectronics (ST) will be announcing today that SP has been appointed to upgrade ST’s cooling infrastructure at its Toa Payoh site. This serves as a critical hub for ST’s packaging R&D and wafer testing operations. This new tailored, integrated system with dual-temperature capability, has a cooling capacity of 3,200 refrigerant tons. It will save up to five Gigawatt-hours of energy annually, equivalent to powering over 1,100 four-room HDB households a year, and is expected to reduce carbon emissions by approximately 2,140 tons annually.

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- 20 May 2025